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Synova · LGS – Laser Edge Grinding Machines . The Laser Microjet® wafer edge grinding machine is suitable for grinding, drilling and slotting of wafers.
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Makino and Synova inaugurate laser microjet demo center. New facility at Makino in Atsugi, Japan, will be set up with three MCS machines.
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TOKYO, October 3, 2014 /PR Newswire UK/ -- MAKINO and SYNOVA Inaugurate New Laser MicroJet Demo Center in Atsugi, Japan.
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